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PC / Edge AI PN-Palladio-500-RPL-AI
KIKI-InferenzGPU

PC / Edge AI - PN-Palladio-500-RPL-AI - SECO - KI / KI-Inferenz / GPU
PC / Edge AI - PN-Palladio-500-RPL-AI - SECO - KI / KI-Inferenz / GPU
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Eigenschaften

Typ
Edge AI, GPU, KI, KI-Inferenz
Konfigurierung
embedded
Prozessor
Intel® Core i5, Intel® Core i7, Intel® Core i3, Intel® Core™ i9-13900
Ports
DisplayPort, RS-232, RS-485, RJ45, WiFi, 2,5 GbE, RS-422, USB 3.2, Bluetooth, SATA III
Nutzsystem
Linux, Windows
Weitere Eigenschaften
PoE, mit KI-Beschleunigungsmodul
Speicher
32 GB

Beschreibung

Produktübersicht
The Palladio 500 RPL AI is a modular embedded PC and high-performance industrial workstation powered by 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics. Modular design optimized for edge AI and advanced graphics applications.

Höhepunkte
  • CPU: 13th Gen Intel® Core™ i3/i5/i7/i9 Processors
  • AI Accelerator: Intel® Arc™ Pro B50 powered AI acceleration (up to 170 INT8 TOPS)
  • Memory: Up to 32 GB SO-DIMM DDR4 2666
  • Connectivity: 2x 2.5 GbE LAN (2x PoE optional)

Kurzbeschreibung
Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics. The Palladio 500 RPL AI is a high-performance industrial workstation for edge AI and advanced graphics applications.

Charactéristiques / spécifications techniques
  • CPU Description: 13th Gen Intel® Core™ Processors (codename: Raptor Lake-P)
    • Intel® Core™ i3-13100E, 3.3~4.4 GHz, 4 cores, 8 threads - 60 W TDP
    • Intel® Core™ i3-13100TE, 2.1~4.1 GHz, 4 cores, 8 threads - 35 W TDP
    • Intel® Core™ i5-13500E, 2.4~4.6 GHz, 14 cores, 20 threads - 65 W TDP
    • Intel® Core™ i5-13500TE, 1.3~4.5 GHz, 14 cores, 20 threads - 35 W TDP
    • Intel® Core™ i7-13700E, 1.9~5.1 GHz, 16 cores, 24 threads - 65 W TDP
    • Intel® Core™ i7-13700TE, 1.1~4.8 GHz, 16 cores, 24 threads - 35 W TDP
    • Intel® Core™ i9-13900E, 1.8~5.2 GHz, 24 cores, 32 threads - 65 W TDP
    • Intel® Core™ i9-13900TE, 1.0~5.0 GHz, 24 cores, 32 threads - 35 W TDP
  • Memory: Up to 32 GB SO-DIMM DDR4 2666 (optional)
  • Graphics: Intel® Arc™ Pro B50 Graphics with 16 GB DDR6 VRAM support; support for up to four independent displays at up to 8K60 resolution
  • Video Interfaces: 2x DisplayPort
  • Video Resolution: Up to 4K @ 60 Hz
  • Mass Storage: 1x M.2 2280 (SATA); 1x M.2 2280 (PCIe Gen4 x4; SATA); 2x SATA 2.5" drives (optional hot-swap); 1x M.2 2280 (PCIe Gen4 x4)
  • Networking: Intel® embedded M.2 2230 802.11ac Wi‑Fi BT 5.1 card with cables (optional); Dual-band wireless terminal PIFA antenna (optional); 2x 2.5 GbE LAN (2x PoE optional)
  • USB: 6x USB 3.2 Gen 2 ports
  • PCI / Expansion: 1x mPCIe (PCIe x1; USB 2.0); 1x M.2 2230 E-key (PCIe x1; USB 2.0); 1x M.2 2280 M-key (PCIe Gen4 x4); 1x M.2 2280 M-key (PCIe Gen4 x4; SATA); 1x M.2 3042/3052/2280 B-key (PCIe x2; USB 2.0; USB 3.0; SATA); 1x PCIe Gen4 x16 or 2x PCIe Gen4 x8 (factory option)
  • Audio: 1x 3.5 mm audio
  • Serial Ports: 2x COM RS-232/422/485 ports
  • Other Interfaces: 5‑Pin terminal block power input (12~48 VDC); 2x ModBay expansion 7‑9.5 mm (optional); 1x GPIO terminal block (DIO, CAN, Ext. Switch); 2x 3FF Micro‑SIM; 1x power button; 1x external fan connector; 2x 2.5" hot-swap drives (optional)
  • Security: PTT in BIOS; TPM (optional); Watchdog timer
  • Power Supply: 12~48 VDC (20~48 VDC when configured with PCIe expansion 70W or above)
  • Operating System: Compatible with Linux, Windows
  • Operating Temperature: -40 to 70°C (with 35W CPU); -40 to 50°C (with 65W CPU)
  • Dimensions: 240 x 143 x 267 mm

Kataloge

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* Die Preise verstehen sich ohne MwSt., Versandkosten und Zollgebühren. Eventuelle Zusatzkosten für Installation oder Inbetriebnahme sind nicht enthalten. Es handelt sich um unverbindliche Preisangaben, die je nach Land, Kurs der Rohstoffe und Wechselkurs schwanken können.